The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering
Crossref DOI link: https://doi.org/10.1007/s11664-016-5189-7
Published Online: 2016-12-19
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, J. Q.
Zhou, M. B.
Zhang, X. P.
Funding for this research was provided by:
Natural Science Foundation of China (51275178, 51405162)
License valid from 2016-12-19