Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows
Crossref DOI link: https://doi.org/10.1007/s11664-016-5211-0
Published Online: 2016-12-20
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Yan http://orcid.org/0000-0002-3452-8415
Hatch, Olen
Liu, Pilin
Goyal, Deepak
License valid from 2016-12-20