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Authors
Wu, Sixin
Jiang, Jing
Liang, Yinglin
Yang, Ping
Niu, Yi
Chen, Yide
Xia, Junfeng
Wang, Chao
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Funding
Funding for this research was provided by:
the Fundamental Research Funds for the Central Universities (ZYGX2014J087)
the Fundamental Research Funds for the Central Universities (ZYGX2013J115)
the Fundamental Research Funds for the Central Universities (ZYGX2015J029)
the open fund of State Key Laboratory of Electronic Thin Films and Integrated Devices of UESTC (KFJJ201411)
State Key Laboratory of Advanced Welding and Joining of HIT (AWJ–M16–07)
the Department of Science and Technology of Sichuan Province (2014GZ0151)
the Department of Science and Technology of Sichuan Province (2015JY0066)
the Department of Science and Technology of Sichuan Province (2016JQ0022)
the National Natural Science Foundation of China (61604031)
the National Natural Science Foundation of China (51672037)
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