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Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

Crossref DOI link: https://doi.org/10.1007/s11664-017-5385-0

Published Online: 2017-03-02

Published Print: 2017-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hung, H. T.

Yang, S.

Chen, Y. B.

Kao, C. R.
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (104-2221-E-002-040-MY3)

National Taiwan University (103R891804)
License Information

License valid from 2017-03-02