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Authors
Huong, Hoang Thi Lan
Cong, Nguyen Dinh
Nghia, Nguyen Xuan
Lieu, Nguyen Thi Thuy
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Funding
Funding for this research was provided by:
Key Laboratory for Electronic Materials and Devices, Institute of Materials Science, Vietnam Academy of Science and Technology (KHVL-TNTD.03)
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