Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
Crossref DOI link: https://doi.org/10.1007/s11664-017-5464-2
Published Online: 2017-03-27
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gao, Yue
Zhang, Hao
Li, Wanli
Jiu, Jinting
Nagao, Shijo
Sugahara, Tohru
Suganuma, Katsuaki
Funding for this research was provided by:
Grant-in-Aid for Scientific Research (Kaken S) (24226017)
License valid from 2017-03-27