Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials
Crossref DOI link: https://doi.org/10.1007/s11664-017-5486-9
Published Online: 2017-04-18
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kolb, H. http://orcid.org/0000-0003-2614-1250
Sottong, R.
Dasgupta, T.
Mueller, E.
de Boor, J.
Funding for this research was provided by:
Helmholtz-Gemeinschaft
Bundesministerium für Wirtschaft und Energie (KF3139401DF3)
License valid from 2017-04-18