Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder
Crossref DOI link: https://doi.org/10.1007/s11664-017-5507-8
Published Online: 2017-04-14
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, Xu
Takaya, Satoshi
Muraoka, Mikio
License valid from 2017-04-14