Overcoming Etch Challenges on a 6″ Hg1−x Cd x Te MBE on Si Wafer
Crossref DOI link: https://doi.org/10.1007/s11664-017-5587-5
Published Online: 2017-05-26
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Apte, Palash
Norton, Elyse
Robinson, Solomon
License valid from 2017-05-26
