Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-017-5591-9
Published Online: 2017-05-30
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Haseeb, A. S. M. A.
Arafat, M. M.
Tay, S. L.
Leong, Y. M.
Funding for this research was provided by:
High Impact Research (HIR) Grant, University of Malaya (UM.C/625/1/HIR/MOHE/ENG/26)
License valid from 2017-05-30