Study on the Effect of Mn, Zn, and Sb on Undercooling Behavior of Sn-Ag-Cu Alloys Using Differential Thermal Analysis
Crossref DOI link: https://doi.org/10.1007/s11664-017-5634-2
Published Online: 2017-06-28
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mao, Jie
Reeves, Benjamin
Lenz, Brendan
Ruscitto, Daniel
Lewis, Dan
Funding for this research was provided by:
Semiconductor Research Corporation (1292.089)
Rensselaer Polytechnic Institute (Undergraduate Research Program)
License valid from 2017-06-28