Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance
Crossref DOI link: https://doi.org/10.1007/s11664-017-5650-2
Published Online: 2017-06-26
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Tae-Kyu http://orcid.org/0000-0002-3433-8152
Chen, Zhiqiang
Guirguis, Cherif
Akinade, Kola
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