Carrier Transport Mechanism and Band Offsets at the Interface of ZnS/n-Si (111) Heterojunctions Fabricated by Vacuum Thermal Evaporation
Crossref DOI link: https://doi.org/10.1007/s11664-017-5659-6
Published Online: 2017-07-05
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Ya-Peng
Li, Ying-Feng
Wang, Jian-Yuan
Zhang, Yong-Hong
Xu, Feng
Funding for this research was provided by:
National Natural Science Foundation of China (No. 51402240)
License valid from 2017-07-05