Effects of Zn and Ga Additions to Suppress PdSn4 Growth at a Solder/Pd Interface Under Current Stressing
Crossref DOI link: https://doi.org/10.1007/s11664-017-5676-5
Published Online: 2017-07-18
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Chao-hong
Li, Kuan-ting
Chen, Ke-hsing
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (104-2221-E-194-062-MY2)
License valid from 2017-07-18