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Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate

Crossref DOI link: https://doi.org/10.1007/s11664-017-5685-4

Published Online: 2017-07-31

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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