Effects of Additives on Electrochemical Growth of Cu Film on Co/SiO2/Si Substrate by Alternating Underpotential Deposition of Pb and Surface-Limited Redox Replacement by Cu
Crossref DOI link: https://doi.org/10.1007/s11664-017-5692-5
Published Online: 2017-08-02
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fang, J. S.
Lin, L. Y.
Wu, C. L.
Cheng, Y. L.
Chen, G. S.
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (104-2221-E-150-005-MY2)
License valid from 2017-08-02