Residual Strain in PCBs with Cu-Plated Holes
Crossref DOI link: https://doi.org/10.1007/s11664-017-5714-3
Published Online: 2017-08-07
Published Print: 2017-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rudajevova, A.
DuĊĦek, K.
Funding for this research was provided by:
Czech Research Infrastructures (LM 2011025)
Grant Agency of the Czech Technical University in Prague (SGS15/196/OHK3/3T/13)
License valid from 2017-08-07