Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11664-017-5716-1
Published Online: 2017-08-16
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Shengfa
Hu, Zhebing
Xiong, Jieran
Tan, Guanghua
Xiong, Wenyong
Chen, Chen
Huang, Shangyu
License valid from 2017-08-16