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Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing

Crossref DOI link: https://doi.org/10.1007/s11664-017-5774-4

Published Online: 2017-09-06

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Yan

Han, Jing

Wang, Yishu

Ma, Limin

Guo, Fu
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51401006)

Beijing Municipal Natural Science Foundation (CN) (2162005, 2172006, 2172009)

Beijing Nova Program (Z161100004916155)

the Science and Technology Project of Beijing Municipal Education Commission (KM201710005003)
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