Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion
Crossref DOI link: https://doi.org/10.1007/s11664-017-5786-0
Published Online: 2017-09-19
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kanjilal, Anwesha
Kumar, Praveen
Funding for this research was provided by:
Indian Space Research Organisation (ISTC 0367)
License valid from 2017-09-19