Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications
Crossref DOI link: https://doi.org/10.1007/s11664-017-5792-2
Published Online: 2017-09-18
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Byung-Suk
Yoon, Jeong-Won
License valid from 2017-09-18