Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition
Crossref DOI link: https://doi.org/10.1007/s11664-017-5831-z
Published Online: 2017-11-06
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Zijian
Cai, Jian
Wang, Junqiang
Geng, Zhiting
Wang, Qian
Funding for this research was provided by:
National Basic Program of China (2015CB057205)
National Natural Science Foundation of China (CN) (61674088)
License valid from 2017-11-06