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Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Crossref DOI link: https://doi.org/10.1007/s11664-017-5834-9

Published Online: 2017-10-16

Published Print: 2018-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yakymovych, A. https://orcid.org/0000-0002-2884-9984
Švec, P. Sr.

Orovcik, L.

Bajana, O.

Ipser, H.
Funding

Funding for this research was provided by:

Austrian Science Fund (P 27049)

Austrian Science Fund (P 26304)

Vedecká Grantová Agentúra MŠVVaŠ SR a SAV (VEGA 2/0172/16)

Vedecká Grantová Agentúra MŠVVaŠ SR a SAV (VEGA 2/0082/17)

Vedecká Grantová Agentúra MŠVVaŠ SR a SAV (APVV-15-0049)
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Article History

Received: 28 April 2017

Accepted: 27 September 2017

First Online: 16 October 2017