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Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

Published Online: 2017-10-23

Published Print: 2018-01

Authors

Pei, Chun https://orcid.org/0000-0001-9727-1920
Chen, Chuantong

Suganuma, Katsuaki

Fu, Guicui
Funding

Funding for this research was provided by:

China Scholarship Council (201606020080)

Japan Science and Technology Agency (J165101047)
License Information

Text and Data Mining valid from 2017-10-23

Version of Record valid from 2017-10-23
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Article History

Received: 15 May 2017

Accepted: 3 October 2017

First Online: 23 October 2017

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