Effect of Thermal Mechanical Behaviors of Cu on Stress Distribution in Cu-Filled Through-Silicon Vias Under Heat Treatment
Crossref DOI link: https://doi.org/10.1007/s11664-017-5885-y
Published Online: 2017-10-31
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, Xuewei
Ma, Limin
Wang, Yishu
Guo, Fu
Funding for this research was provided by:
Beijing Nova Program (Z161100004916155)
General program of science and technology of Beijing Municipal Education Commission (SQKM201610005024)
License valid from 2017-10-31