Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules
Crossref DOI link: https://doi.org/10.1007/s11664-017-5906-x
Published Online: 2017-11-13
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Wen-Chih
Li, Ying-Sih
Wu, Albert T.
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST104-2221-E-008-065-MY3)
License valid from 2017-11-13