Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing
Crossref DOI link: https://doi.org/10.1007/s11664-017-6038-z
Published Online: 2018-01-08
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Zhuo
Tian, Wenya
Li, Junhui http://orcid.org/0000-0001-5196-9960
Zhu, Wenhui
Funding for this research was provided by:
National Basic Research Program of China 973 (2015CB057206)
State Key Laboratory of High Performance Complex Manufacturing (ZZYJKT2016-08)
China Postdoctoral Science Foundation (2016M590752)
License valid from 2018-01-08