Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder
Crossref DOI link: https://doi.org/10.1007/s11664-018-6067-2
Published Online: 2018-01-12
Published Print: 2018-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Oda, Yukinori
Fukumuro, Naoki
Yae, Shinji http://orcid.org/0000-0003-1181-4811
Text and Data Mining valid from 2018-01-12
Article History
Received: 12 August 2017
Accepted: 4 January 2018
First Online: 12 January 2018