Crossmark

Recrystallization Behavior in Mixed Solder Joints of BGA Components during Thermal Shock

Crossref DOI link: https://doi.org/10.1007/s11664-018-6124-x

Published Online: 2018-03-14

Published Print: 2018-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Tan, Shihai

Han, Jing

Guo, Fu
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (No. 51401006)

Beijing Natural Science Foundation (No. 2162005)

Beijing Natural Science Foundation (No. 2172009)

Science and Technology Project of Beijing Municipal Education Commission (No. KM201710005003)
License Information

Text and Data Mining valid from 2018-03-14
More Information

Article History

Received: 20 April 2017

Accepted: 3 February 2018

First Online: 14 March 2018