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Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material

Published Online: 2018-05-22

Published Print: 2018-08

Authors

Sharma, Deepak

Jain, Aman

Somaiah, Nalla

Narayanan, P. Ramesh

Kumar, Praveen
Funding

Funding for this research was provided by:

Indian Space Research Organization (IISc-STC program (ISTC 0305))
License Information

Text and Data Mining valid from 2018-05-22
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Article History

Received: 3 November 2017

Accepted: 3 May 2018

First Online: 22 May 2018

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