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Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process

Crossref DOI link: https://doi.org/10.1007/s11664-018-6428-x

Published Online: 2018-06-15

Published Print: 2018-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Noma, Hirokazu https://orcid.org/0000-0002-3196-3120
Kamibayashi, Takumi

Kuwae, Hiroyuki

Suzuki, Naoya

Nonaka, Toshihisa

Shoji, Shuichi

Mizuno, Jun
Funding

Funding for this research was provided by:

Japan Ministry of Education, Culture, Sports Science & Technology (Scientific Basic Research (A) No. 16H02349, Scientific Basic Research (B) No. 16H04508)

MEXT Nanotechnology Platform Support Project of Waseda University
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Article History

Received: 2 February 2018

Accepted: 2 June 2018

First Online: 15 June 2018