Crossmark

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Crossref DOI link: https://doi.org/10.1007/s11664-018-6515-z

Published Online: 2018-07-18

Published Print: 2019-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Huang, Chao

Rao, Li

Sun, Menglong

Hu, Anmin

Li, Ming
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (61176097, 61376107)

National Basic Research Program of China (973 Program) (2015CB057200)
License Information

Text and Data Mining valid from 2018-07-18
More Information

Article History

Received: 1 December 2017

Accepted: 10 July 2018

First Online: 18 July 2018