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Local Strain Distribution and Microstructure of Grinding-Induced Damage Layers in SiC Wafer

Crossref DOI link: https://doi.org/10.1007/s11664-018-6585-y

Published Online: 2018-08-16

Published Print: 2018-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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