Joining Using Reactive Films for Electronic Applications: Impact of Applied Pressure and Assembled Materials Properties on the Joint Initial Quality
Crossref DOI link: https://doi.org/10.1007/s11664-018-6631-9
Published Online: 2018-09-14
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Khazaka, Rabih http://orcid.org/0000-0001-7555-0152
Martineau, Donatien
Azzopardi, Stéphane
Text and Data Mining valid from 2018-09-14
Article History
Received: 14 May 2018
Accepted: 28 August 2018
First Online: 14 September 2018