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Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Crossref DOI link: https://doi.org/10.1007/s11664-018-6701-z

Published Online: 2018-09-24

Published Print: 2018-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yao, Mingjun

Zhao, Ning https://orcid.org/0000-0001-5509-4989
Wang, Teng

Yu, Daquan

Xiao, Zhiyi

Ma, Haitao
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51675080, 51571049)

Dalian High-level Talents Innovation Support Program (2016RQ007)

Fundamental Research Funds for the Central Universities (DUT17JC44)
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Article History

Received: 28 February 2018

Accepted: 18 September 2018

First Online: 24 September 2018