Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED
Crossref DOI link: https://doi.org/10.1007/s11664-018-6727-2
Published Online: 2018-10-10
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chang, Pai-Jung http://orcid.org/0000-0002-0930-2609
Tang, Yue-Kai
Lai, Wei-Han
Chiang, Anthony Shiaw-Tseh
Liu, C. Y.
Text and Data Mining valid from 2018-10-10
Article History
Received: 18 April 2018
Accepted: 4 October 2018
First Online: 10 October 2018