Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias
Crossref DOI link: https://doi.org/10.1007/s11664-018-6805-5
Published Online: 2018-11-21
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Hanry
Lee, Tae-Kyu http://orcid.org/0000-0002-3433-8152
Meinshausen, Lutz
Dutta, Indranath
Funding for this research was provided by:
National Science Foundation (DMR-1309843)
Text and Data Mining valid from 2018-11-21
Version of Record valid from 2018-11-21
Article History
Received: 8 June 2018
Accepted: 10 November 2018
First Online: 21 November 2018