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Synergistic Influence of Cu Intercalation on Electronic and Thermal Properties of n-Type CuxBi2Te2.7Se0.3 Polycrystalline Alloys

Crossref DOI link: https://doi.org/10.1007/s11664-019-06973-6

Published Online: 2019-01-25

Published Print: 2019-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Cho, Hyun-jun

Shin, Weon Ho

Choo, Sung-sil

Kim, Ji-il

Yoo, Joonyeon

Kim, Sang-il
Funding

Funding for this research was provided by:

Samsung (SRFC-MA1701-05)
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Text and Data Mining valid from 2019-01-25
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Article History

Received: 18 August 2018

Accepted: 16 January 2019

First Online: 25 January 2019