Development of High-Durability Substrates for Thermoelectric Modules
Crossref DOI link: https://doi.org/10.1007/s11664-019-06998-x
Published Online: 2019-02-08
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Arai, Koya
Nishimoto, Shuji
Romanjek, Krunoslav
Komasaki, Masahito
Nagatomo, Yoshiyuki
Kuromitsu, Yoshirou
Text and Data Mining valid from 2019-02-08
Article History
Received: 12 July 2018
Accepted: 23 January 2019
First Online: 8 February 2019