Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles
Crossref DOI link: https://doi.org/10.1007/s11664-019-07046-4
Published Online: 2019-02-13
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gao, Runhua
He, Siliang
Shen, Yu-An
Nishikawa, Hiroshi
Text and Data Mining valid from 2019-02-13
Article History
Received: 10 September 2018
Accepted: 5 February 2019
First Online: 13 February 2019