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Minor P Doping to Effectively Suppress IMC Growth in Solder Joints with Electroplated Co(P) Metallization

Published Online: 2019-04-30

Published Print: 2019-07

Authors

Wang, Chao-hong https://orcid.org/0000-0002-4137-5584
Lin, Che-yang
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (MOST 106-2221-E-194-053)
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Text and Data Mining valid from 2019-04-30
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Article History

Received: 10 September 2018

Accepted: 6 April 2019

First Online: 30 April 2019

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