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Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints

Crossref DOI link: https://doi.org/10.1007/s11664-019-07211-9

Published Online: 2019-05-02

Published Print: 2019-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wu, Jie

Xue, Songbai

Wang, Jingwen

Xue, Peng
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (No. 51675269)

the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD)
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Article History

Received: 25 October 2018

Accepted: 9 April 2019

First Online: 2 May 2019