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Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder

Crossref DOI link: https://doi.org/10.1007/s11664-019-07316-1

Published Online: 2019-06-11

Published Print: 2019-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hillman, Dave

Wilcoxon, Ross https://orcid.org/0000-0002-0717-4500
Pearson, Tim

McKenna, Paul
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Text and Data Mining valid from 2019-06-11

Version of Record valid from 2019-06-11
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Article History

Received: 26 September 2018

Accepted: 21 May 2019

First Online: 11 June 2019