Hermetic Sealant Material Possibilities for IR Sensor Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-019-07427-9
Published Online: 2019-07-19
Published Print: 2019-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chidambaram, Vivek
Bu, Lin
Chuan, Kai Liang
Text and Data Mining valid from 2019-07-19
Version of Record valid from 2019-07-19
Article History
Received: 28 February 2019
Accepted: 4 July 2019
First Online: 19 July 2019