Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties
Crossref DOI link: https://doi.org/10.1007/s11664-019-07456-4
Published Online: 2019-07-29
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Vianco, Paul T.
McKenzie, Bonnie B.
Rejent, Jerome A.
Grazier, J. Mark
Jaramillo, Celedonio E.
Kilgo, Alice C.
Text and Data Mining valid from 2019-07-29
Version of Record valid from 2019-07-29
Article History
Received: 10 May 2019
Accepted: 17 July 2019
First Online: 29 July 2019