Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package
Crossref DOI link: https://doi.org/10.1007/s11664-019-07463-5
Published Online: 2019-08-09
Published Print: 2019-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Ho Hyung
Kwak, Jae B. http://orcid.org/0000-0002-7507-6021
Funding for this research was provided by:
Chosun University (K207814001-1)
Text and Data Mining valid from 2019-08-09
Version of Record valid from 2019-08-09
Article History
Received: 12 August 2018
Accepted: 19 July 2019
First Online: 9 August 2019