Lifetime Prediction of Electrochemical Ion Migration with Various Surface Finishes of Printed Circuit Boards
Crossref DOI link: https://doi.org/10.1007/s11664-019-07595-8
Published Online: 2019-09-05
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hong, Won Sik http://orcid.org/0000-0001-8398-177X
Oh, Chulmin
Text and Data Mining valid from 2019-09-05
Version of Record valid from 2019-09-05
Article History
Received: 1 May 2019
Accepted: 27 August 2019
First Online: 5 September 2019