Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C
Crossref DOI link: https://doi.org/10.1007/s11664-019-07727-0
Published Online: 2019-10-31
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hadian, Faramarz
Schoeller, Harry
Cotts, Eric http://orcid.org/0000-0001-9899-5891
Funding for this research was provided by:
SRC (18015223)
Text and Data Mining valid from 2019-10-31
Version of Record valid from 2019-10-31
Article History
Received: 6 May 2019
Accepted: 10 October 2019
First Online: 31 October 2019