Wafer Flatness Modeling in Chemical Mechanical Polishing
Crossref DOI link: https://doi.org/10.1007/s11664-019-07799-y
Published Online: 2019-11-13
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, Chaoyue
Li, Jianyong
Yi, Defu
Li, Baozhen
Cao, Jianguo http://orcid.org/0000-0001-8863-9244
Funding for this research was provided by:
Fundamental Research Funds for the Central Universities (2019JBM049)
Text and Data Mining valid from 2019-11-13
Version of Record valid from 2019-11-13
Article History
Received: 5 August 2019
Accepted: 1 November 2019
First Online: 13 November 2019