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Development of High-Temperature-Resistant Seed Layer for Electrodeposition of Copper for Microelectronic Applications

Published Online: 2019-11-26

Published Print: 2020-02

Authors

Frost, Garrison

Ladani, Leila https://orcid.org/0000-0002-5715-9851
Funding

Funding for this research was provided by:

Directorate for Engineering (1734983)
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Text and Data Mining valid from 2019-11-26

Version of Record valid from 2019-11-26
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Article History

Received: 13 January 2019

Accepted: 12 November 2019

First Online: 26 November 2019

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